Semiconductor automation equipment refers to improve production efficiency, accuracy and yield, machines and equipment that automatically perform wafer transfer, storage, inspection, handling, packaging and testing during the semiconductor manufacturing process These devices include wafer handling systems (such as AGVs, OHTs, and EFEMs), storage equipment (such as stockers), inspection and measurement equipment (such as wafer sorters), and auxiliary equipment for processes such as lithography, etching, and deposition. The use of automated equipment can optimize manufacturing processes, help the semiconductor industry meet high production demands, and ensure stable and controlled product quality.
Main categories and functions
Wafer handling and storage systems
Wafer transport system : This includes transporting wafers between different process equipment through AGV (automated guided vehicle), AMR (autonomous mobile robot), RGV (conveyor-type automated guided vehicle) or OHT (overhead transport system).
Wafer storage equipment : such as Stocker, which is used to store wafer boxes (FOUP) and wafer stacking boxes in a clean room and can provide a nitrogen protection environment.
High-speed wafer/carrier transport equipment (EFEM) : used to remove wafers or carriers from wafer boxes and transfer them to the chamber of process equipment.
Testing and measurement equipment
Wafer sorter : Responsible for transferring, sorting, and arranging wafers in different wafer boxes, and sorting, batching, or merging wafers according to the marking numbers.
Wafer appearance inspection equipment : used to check whether there are defects on the wafer surface and improve product yield.
Process auxiliary and integration equipment
Lithography/etching related equipment : including loading and unloading inspection equipment, used for wafer loading and unloading, precise carrier transfer and positioning, to ensure the accuracy of the lithography and etching processes.
Laser cutting and scribing machine : used for laser cutting and scribing operations on wafers or panels.
EUV mask pellicle automatic bonding equipment : specially designed for high-end EUV process, automatically bonding the mask pellicle to the mask.
Automation system integration : Integrate multiple devices into fully automated production lines or smart factory solutions.
Importance and benefits
Improve efficiency and accuracy : Automation reduces human intervention and increases the speed and accuracy of wafer processing.
Ensure quality and yield : High-precision automated equipment helps reduce errors in the manufacturing process and stabilize product line width control and yield.
Meeting high demand : Against the backdrop of the semiconductor industry's huge demand for high-quality products, automation is key to meeting production scale.
Reduce contamination risk : Highly automated wafer transfer and handling processes help reduce the chance of external contamination.